Airbus A320 SOP 03Taxi and Before Takeoff

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Contaminated base metal will dewet or blister the solder coating when reflowed. 5 Excessive intermetallic growth. Intermetallic growth occurs at the interface of solder and copper. Heat accelerates the rate of intermetallic growth. When this happens, tin in the solder combines with copper to form the compounds Cu6Sn5 and Cu3Sn. 4). 6 Physical damage during manufacture. Scratches or abrasions on the component lead which expose the base metal will cause solderabi~ity problems. The”base metal may be unsolderable or may become unsolderable as the exposed metal becomes oxidized.

Greater exit pupil size (final image size) microscopes are easier to use. In addition, factors such as depth of field, field of view, and clarity will affect the users’ ability to inspect. , the feedback of light) is a critical factor and should be maximized. Microscopes used for inspecting a variety of assembly types should be easily adjustable to differing working heights relative to the work inspected. To reduce operator fatigue, the microscope eyepiece height should be relatively easy to adjust.

The less active flux and lower solder temperature than normal soldering conditions make the test more sensitive to solderability problems than the soldering process. 95% coverage of the lead indicates acceptable solderability. Another method for testing solderability is the wetting balance described in MIL-STD-883, Method 2003. The wetting balance measures the force on the lead as a function of time as the lead is dipped in molten solder. Prior to solder wetting the lead, the surface tension of the solder will cause the lead to float orIthe solder.

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